JPH0244452Y2 - - Google Patents
Info
- Publication number
- JPH0244452Y2 JPH0244452Y2 JP8076788U JP8076788U JPH0244452Y2 JP H0244452 Y2 JPH0244452 Y2 JP H0244452Y2 JP 8076788 U JP8076788 U JP 8076788U JP 8076788 U JP8076788 U JP 8076788U JP H0244452 Y2 JPH0244452 Y2 JP H0244452Y2
- Authority
- JP
- Japan
- Prior art keywords
- male
- female
- wire
- portions
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009413 insulation Methods 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000013011 mating Effects 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8076788U JPH0244452Y2 (en]) | 1988-06-17 | 1988-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8076788U JPH0244452Y2 (en]) | 1988-06-17 | 1988-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH023665U JPH023665U (en]) | 1990-01-11 |
| JPH0244452Y2 true JPH0244452Y2 (en]) | 1990-11-26 |
Family
ID=31305584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8076788U Expired JPH0244452Y2 (en]) | 1988-06-17 | 1988-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244452Y2 (en]) |
-
1988
- 1988-06-17 JP JP8076788U patent/JPH0244452Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023665U (en]) | 1990-01-11 |
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